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VAWDM

WAFER BOOK CUTTERS 

VAWDM

From the individual or stacked wafer books to smaller wafer fingers.

 

VAWDM

The wafer book cutters cut the wafer books discharged from the wafer book cooler to smaller wafer fingers of the desired size.

 

Technical Data:

  • fully automatic operation, up to 14 cuts/min
  • cutting of individual books or of several stacked books possible
  • product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
  • tandem or twin execution (VAWDM-T or VAWDM-Z) for higher capacities, simultaneous production of wafer fingers in two different sizes possible with tandem execution
  • combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
  • special versions, for example for caramel, available

Possible End Products

An overview about the whole range of possibilities

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