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VAWDK

WAFER BOOK CUTTERS 

VAWDK

From the wafer book to smaller wafer fingers.

 

VAWDK

The VAWDK cutters are designed for cutting products which cannot be stacked such as sprinkled wafer books.

 

Technical Data:

  • fully automatic operation, up to 20 cuts/min
  • product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
  • hydropneumatic device for lifting the feeder unit facilitates cleaning
  • double execution allows higher capacities (VAWDK-D)
  • combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
  • special versions, for example for caramel, available

Possible End Products

An overview about the whole range of possibilities

Haas Worldwide

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