From the wafer book to smaller wafer fingers.


The VAWDK cutters are designed for cutting products which cannot be stacked such as sprinkled wafer books.


Technical Data:

  • fully automatic operation, up to 20 cuts/min
  • product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
  • hydropneumatic device for lifting the feeder unit facilitates cleaning
  • double execution allows higher capacities (VAWDK-D)
  • combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
  • special versions, for example for caramel, available

Application & Technology Center

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