WAFER BOOK CUTTERS
From the wafer book to smaller wafer fingers.
The VAWDK cutters are designed for cutting products which cannot be stacked such as sprinkled wafer books.
- fully automatic operation, up to 20 cuts/min
- product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
- hydropneumatic device for lifting the feeder unit facilitates cleaning
- double execution allows higher capacities (VAWDK-D)
- combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
- special versions, for example for caramel, available
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