From the wafer book to smaller wafer fingers.


The VAWDK cutters are designed for cutting products which cannot be stacked such as sprinkled wafer books.


Technical Data:

  • fully automatic operation, up to 20 cuts/min
  • product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
  • hydropneumatic device for lifting the feeder unit facilitates cleaning
  • double execution allows higher capacities (VAWDK-D)
  • combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
  • special versions, for example for caramel, available

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HAAS of America
For customers in the US and in Canada, we founded our affiliate in Richmond, Virginia. We are the leading supplier of baking ovens, processing equipment and related services. Our local sales and service team ensures your access to the reliable HAAS services.