Hollow Wafer Pralines

All kinds of cream-filled hollow wafer pralines are produced on semi- or fully automatic production lines. After mixing, the batter is poured onto baking plates and baked to wafer sheets. Depending on the desired capacity, the electrically or gas-heated baking ovens are equipped with 20 to 88 baking plate pairs.

For the production of hollow wafer pralines, mostly an oven is used with baking plates where half of the plate is executed with the hollow shape of the top part and the other half with the hollow shape of the bottom part.

As most of the hollow wafer pralines are coated with chocolate, conditioning is principally always recommended (that is, wafer sheets are enriched with moisture to prevent later cracking of the chocolate coat). The cream is applied by a special film spreading machine or by a depositor filling the cream into the cavities of the hollow wafer sheet.

Afterwards the top and the bottom hollow wafer sheets are sandwiched to a hollow wafer book. After cooling this book is cut into two halfs which are fed to a punching machine. Rotating cylindrical tools cut out pralines from the wafer book. Finally, a pick-and-place-system transfers them to a chocolate enrober or packaging machine.