Hollow Wafer Line

FRANZ HAAS WAFER POWERED BY HAAS-MONDOMIX 

Hollow Wafer Line

Featuring our ECO principle and the Laser Cleaning Unit

Hollow Wafer Line

Hollow Wafer Line

The presented hollow wafer line will include, besides the proven downstream equipment, also three novelties. The SWAKT-ECO, the new oven generation based on a new heating principle meeting challenges like gas and emission reduction. The WIS-EAGLE, a proven wafer sheet inspection system offering now more features like inspection of thickness, shape, moisture and color. And the MPRD (Multi Piston Rotary Depositor), the depositor with the highest accuracy available on the market. Even highly aerated masses can be processed with the MPRD and it fits perfectly into the hollow wafer line to produce fat cream chocolate-filled wafer pralines.

 

Your benefits:

  • baking oven with economic utilization of gas
  • wafer sheet monitoring system for stable production process
  • high-precision filling process
  • hollow wafers with aerated fillings possible

 

The following downstream equipment will be on display:

Archway Type Cooler TBK, High-Speed Book Builder HL-ZLV, Hollow Wafer Punch VBSTZ, Pick-and-Place Device US and an Acceleration Belt BSB.

 

 

This production line can also be equipped with a Laser Cleaning Unit that offers a completely new, gentle and precise cleaning module for contaminated baking plates. It can be used on all ovens of the series SWAKN, SWAKT and SWAKT-HC and is suitable for all baking plates, plate dimensions, all flat and almost all hollow wafer engravings. The cleaning unit is highly flexible and applicable to all new machines due to a standardized interface. Furthermore, it can be retrofit to previous models.

 

Your benefits:

  • gentle and precise cleaning
  • no mechanical stress
  • no damage to chromium plating
  • no need for clean-up
  • no residues due to suction system
  • environmentally friendly - no cleaners, no chemicals, no solvents