With the new Free-Shape Cutter, the production of all kinds of free-shaped wafers is now easily possible. The shapes are produced by two cutters in a three-step cutting process. First, the wafer book is trimmed to the right size and cut into square or rectangular single wafers. Secondly, the first half of a shape is produced by the first cutter and thirdly the second half of the shape is completed by the second cutter. The modular design of the machine allows an ideal configuration for the respective product. Depending on the complexity of the end product, a multistage cutting process is also possible. At interpack you will see a version with three wafer book cutters which allows almost any shape of wafer pieces.
- modular design allows easy later machine configuration changes for new products
- wafer book is reliably guided between supports and from the top during cutting and transport between the single steps