We will display a wide selection of new and innovatively improved machines from all our business units.
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![]() cream-filled flat wafer ![]() pressed wafer sticks ![]() PHP-EWB ![]() cream-filled wafer fingers ![]() pillow sticks |
Exhibition “Interpack“
Event facts
Place: Duesseldorf, Germany
Date: 24. – 30. April 2008 Booth: Hall 3, A27/B46 We will display a wide selection of new and innovatively improved machines from all our business units.
Wafer Field
Biscuit Field
Mixing/Aerating
Mini Mondo
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