Place: Expocentr, Moscow, Russia
Time: 13. - 17. Okt. 2008
Booth: Hall 2-1/No. 21C10 and Hall 8-1/No. 81C10

We present ...

• an automatic wafer stick baking oven of the type EWB-R IND in combination with a pillow stick crimper (booth 21C10)
• an automatic wafer baking oven type SWAKN (booth 81C10)

Main features of the EWB-R IND oven:

• fully automatic production of wafer sticks
• baking ring with electric induction heating: no hazardous emissions, environmentally friendly, low operationg noise, high heat efficiency of more than 70%
• all-stainless-steel panelling
• vented side doors ensure pleasant temperature in the working area
• baking ring and rolling tools driven by frequency-controlled motors
• PLC with automatic baking temperature control
• operation via touchscreen
• all electric and electronic components integrated into the machine: no need for external wirings and switch cabinets
• optional devices allow a wide variety of different end products such as two-colored sticks, flattened sticks, fan-shaped wafers or pillow-shaped sticks

Main features of the SWAKN oven:

• for fully automatic production of flat and hollow wafers
• electrically or gas-heated with automatic temperature control
• self-supporting baking plates of special gray cast iron in formats up to 350 x 500 mm
• modular construction facilitates capacity upgradings
• automatic baking chain tensioning for longer service life
• closed oven head for lower energy consumption and higher safety
• all-stainless-steel panelling
• drive by frequency-controlled gearmotor
• integrated switch cabinet
• automatic wafer sheet monitoring