Haas | Wafer Plants | Flat and Hollow Wafers

VAWDM

Cutting

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Wafer Book Cutters VAWDM

The wafer book cutters cut the wafer books discharged from the wafer book cooler to smaller wafer fingers of the desired size.

VAWDM - Technical Data

fully automatic operation, up to 14 cuts/min
cutting of individual books or of several stacked books possible
product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
tandem or twin execution for higher capacities and simultaneous production of wafer fingers in two different sizes
combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
special versions, for example for caramel, available

VAWDM

Wafer Book Cutters VAWDK

The VAWDK cutters are designed for cutting products which cannot be stacked such as sprinkled wafer books.

VAWDK - Technical Data

fully automatic operation, up to 20 cuts/min
product sizes variable by exchangeable cutting frames with cutting wires or blades (depends on application)
hydropneumatic device for lifting the feeder unit facilitates cleaning
double execution allows higher capacities and simultaneous production of wafer fingers in two different sizes
combination of evacuator and wafer waste grinder allows recycling of edge trimmings for wafer cream production
special versions, for example for caramel, available

Wafer Finger Discharger ASV

This device automatically feeds at a rate of up to 40 strokes/min the wafer fingers discharged from the cutter to packaging.

ASV - Technical Data

ASV

Separating Device AZV

The AZV separates the wafer fingers discharged from the wafer book cutter and feeds them in an aligned arrangement to a chocolate enrober.

AZV - Technical Data

AZV

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