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Wafer Book Cooling Tunnel KKH
The KKH is used for continuous cooling of cream-filled wafer books and other products.
KKH - Technical Data
  • modular design, easily extendable
  • rigid stainless steel frame
  • hinged upper cover with integrated air duct for longitudinal distribution of cooling air; uniform product cooling along the entire tunnel
  • conveyor speed infinitely variable
  • compact cooling unit below the tunnel
KKH
KKH
Wafer Book Cooling Tower KKV
The KKV cooling towers are used for the continuous cooling of wafer books in production lines which have to be kept short.
KKV - Technical Data
  • floor area 4 x 1.5 m, cooling tower height approx. 3 – 7.5 m
  • modular design, capacity upgrades easily possible
  • stainless steel frame, PU foam insulation in stainless steel casing
  • infinitely variable conveying speed
  • compact cooling unit with optional dehumidifier
Wafer Book Spiral Cooler SPK
The SPK coolers are used for the cooling of cream-filled wafer books and sprinkled products which may not be turned over. The spiral arrangement of the conveyor allows to accommodate long cooling distances in a narrow space.
SPK - Technical Data
  • cooling conveyor length up to 120 m
  • cooling chamber temperature 4 - 8°C
  • frame, paneling and conveyer belt of stainless steel
  • various infeed and outfeed configurations possible as required
  • easily accessible for cleaning through doors on all sides of the cooler
SPK
SPK
Wafer Book Cooling Presses WK and WKF
The wafer book cooling presses serve to cool cream-filled wafer books in production lines which have to be kept short.
WK, WKF -Technical Data
  • quick cooling of wafer books by direct contact with the cooling tongs (WK) 
  • modular design, capacity upgrades easily possible
  • easily accessible for cleaning and maintenance through doors on all sides of the cooler
  • frame, paneling and cooling tongs/frames of stainless steel
  • cooling chamber temperature 4 - 8°C, controlled by thermostat 
WKF
WKF
Wafer Book Buffer Cooler PUK
As flexible cooler for different speeds and cooling times, the PUK ensures a continuous production flow by its integrated buffer function.
PUK – Technical Data
  • suited for all wafer book formats up to 730 x 380 mm
  • processing of both flat and hollow wafers as well as of wafer books with creamed or sprinkled top layer possible 
  • transport of wafer books in stacking trays with 10 compartments
  • maintenance and cleaning possible without interrupting production
  • uniform quality due to first-in-first-out principle
PUK
PUK